Semiconductor integrated circuit device having a standard cell which includes a fin

ABSTRACT

Disclosed herein is a semiconductor integrated circuit device including a standard cell with a fin extending in a first direction. The fin and a gate line extending in a second direction perpendicular to the first direction and provided on the fin constitute an active transistor. The fin and a dummy gate line provided in parallel with the gate line constitute a dummy transistor. The active transistor shares a node as its source or drain with the dummy transistor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is continuation of U.S. patent application Ser. No. 15/049,680filed on Feb. 22, 2016, which is a continuation of InternationalApplication No. PCT/JP2014/002237 filed on Apr. 21, 2014, which claimspriority to Japanese Patent Application No. 2013-173739 filed on Aug.23, 2013. The entire disclosures of these applications are herebyincorporated by reference.

BACKGROUND

The present disclosure relates to a semiconductor integrated circuitdevice including a standard cell with a transistor having a finstructure.

A standard cell design has been known as a method of forming asemiconductor integrated circuit on a semiconductor substrate. Thestandard cell design refers to a method of designing a large-scaleintegrated circuit (LSI) chip by providing in advance, as standardcells, unit logic elements having particular logical functions (forexample, an inverter, a latch, a flip-flop, and a full adder), layingout those standard cells on a semiconductor substrate, and connectingthose standard cells together through a routing process.

Recently, it has been proposed to utilize transistors with a finstructure (hereinafter referred to as “fin transistors”) in the field ofsemiconductor devices. FIG. 12 schematically illustrates a fintransistor. Unlike a metal oxide semiconductor (MOS) transistor having atwo-dimensional structure, its source and drain have a raised,three-dimensional structure called “fin.” Its gate is disposed so as towrap around a channel region defined between the source and drain inthis fin. In this fin structure, the channel region is defined by threesurfaces of the fin, thereby improving channel controllabilitysignificantly compared to conventional ones. As a result, variousadvantages, including reducing the leakage power, increasing theON-state current, and lowering the operating voltage, are achieved. Thisleads to improving the performance of the semiconductor integratedcircuit.

Japanese Unexamined Patent Application Publication No. 2008-219002teaches, as an improvement for the process step of making such a finstructure, performing selective etching by forming the fin in the samedirection as the crystal-growing direction of a silicon substrate.

SUMMARY

In such a fin structure, the fin is not necessarily formed uniformlyalong its entire length. That is to say, the width of the fin is notnecessarily the same in the length direction, but varies to some extent.In particular, the fin width tends to taper toward the terminal portionthereof. Thus, if a transistor is formed near the terminal portion ofthe fin, chances of achieving the desired performance are slim.

If a wire or contact is connected to the terminal portion of the fin,the degree of electrical contact between the fin and the wire or contactmay decrease due to such a deformation of the terminal portion of thefin, or mask misalignment of the wire or contact, resulting in avariation in resistance characteristic. This variation may cause adecrease in the yield of semiconductor chips.

In view of the foregoing background, it is therefore an object of thepresent disclosure to reduce, in a semiconductor integrated circuitdevice including a standard cell with a fin transistor, the influencecaused by such tapering of the terminal portion of the fin andeventually reduce a variation in performance between the devices.

An aspect of the present disclosure provides a semiconductor integratedcircuit device including a standard cell having a fin extending in afirst direction. The standard cell includes: an active transistorincluding the fin and a gate line extending in a second directionperpendicular to the first direction and provided on the fin; and adummy transistor including the fin and a dummy gate line provided on thefin in parallel with the gate line. The active transistor shares itssource or drain with the dummy transistor.

According to this aspect of the present disclosure, by providing thedummy transistor, the source or drain of the active transistor may bearranged distant from the terminal portion of the fin. That is to say,the node of the active transistor is not positioned at the terminalportion of the fin that is highly likely to have a narrower fin width.This allows for eliminating the influence caused by tapering of theterminal portion of the fin on the active transistor, thus reducing thevariation in performance between the active transistors.

The present disclosure allows for reducing, in a semiconductorintegrated circuit device including a standard cell with a fintransistor, the influence caused by tapering of the terminal portion ofthe fin. This thus allows for reducing a variation in performancebetween the semiconductor integrated circuit devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view illustrating an exemplary layout design for astandard cell included in a semiconductor integrated circuit deviceaccording to a first embodiment.

FIG. 2 is a circuit diagram of the standard cell of FIG. 1.

FIG. 3 is a plan view illustrating a comparative example of the layoutdesign of FIG. 1.

FIG. 4 is a plan view illustrating an exemplary layout design for astandard cell included in a semiconductor integrated circuit deviceaccording to a second embodiment.

FIG. 5 is a plan view illustrating a comparative example of the layoutdesign of FIG. 4.

FIG. 6 is a plan view illustrating another exemplary layout design for astandard cell according to the second embodiment.

FIG. 7 is a plan view illustrating yet another exemplary layout designfor a standard cell according to the second embodiment.

FIG. 8 is a plan view illustrating another exemplary layout design for astandard cell according to an embodiment.

FIG. 9 is a circuit diagram of the standard cell of FIG. 8.

FIG. 10 is a plan view illustrating yet another exemplary layout designfor a standard cell according to an embodiment.

FIG. 11 is a circuit diagram of the standard cell of FIG. 10.

FIG. 12 schematically illustrates a fin transistor.

DETAILED DESCRIPTION

Embodiments of the present disclosure will now be described in detailwith reference to the accompanying drawings. In the followingdescription of embodiments, it is assumed that a semiconductorintegrated circuit device includes a plurality of standard cells, atleast some of which includes a fin transistor.

Also, in this specification, a transistor which contributes to a logicalfunction of the standard cells will be hereinafter referred to as an“active transistor,” and a transistor other than such an activetransistor, i.e., a transistor which does not contribute to any logicalfunction of the standard cells will be hereinafter referred to as a“dummy transistor.”

First Embodiment

FIG. 1 is a plan view illustrating an exemplary layout design of astandard cell included in a semiconductor integrated circuit deviceaccording to a first embodiment. FIG. 2 is a circuit diagram of thestandard cell of FIG. 1. As illustrated in FIG. 2, a standard cell 1 ofFIG. 1 is a cell performing the function of a two-input NOR circuit. InFIG. 1 and other plan views, a fin transistor includes a fin and a gateformed on the fin. A local interconnect is formed so as to be located onthe fin or gate in a region in which the local interconnect overlapswith the fin or gate when viewed in plan, and is electrically connectedto the fin or gate. A metallic interconnect is located over the localinterconnect, and is connected to the local interconnect through acontact. In FIG. 1, the fin is hatched to allow the reader to find thefin easily on the drawing. However, the fin is not hatched at itsportion located under the gate. The local interconnect and metallicinterconnect are also hatched differently, and a portion at which themetallic interconnect and local interconnect are connected togetherthrough a contact is indicated by the solid square. The other plan viewsare illustrated in the same or similar manner.

As illustrated in FIG. 1, the standard cell 1 has fins 11 and 16 whichextend in the lateral direction on the paper (i.e., a first direction).The fin 11 is used to form an n-channel transistor in an n-type region,while the fin 16 is used to form a p-channel transistor in a p-typeregion. In other words, gate lines 12 and 13 extending in the verticaldirection on the paper (i.e., a second direction perpendicular to thefirst direction) and provided on the fin 11 respectively constitute,together with the fin 11, n-channel transistors N1 and N2 functioning asactive transistors. The n-channel transistor N1 shares its drain withthe n-channel transistor N2. Also, gate lines 17, 12, 13, and 18extending in the vertical direction on the paper and provided on the fin16 respectively constitute, together with the fin 16, p-channeltransistors P1, P2, P3, and P4 functioning as active transistors.

A ground line 8 a supplying a ground potential is disposed at the lowerend of the standard cell 1 so as to extend in the lateral direction onthe paper. A power supply line 8 b supplying a power supply potential isdisposed at the upper end of the standard cell 1 so as to extend in thelateral direction on the paper. Dummy gate lines 9 a and 9 b arerespectively disposed at the left and right ends of the standard cell 1so as to extend in the vertical direction on the paper.

In addition, dummy transistors D1 and D2 are further formed on the fin11. That is to say, the fin 11 and a dummy gate line 14 provided on thefin 11 in parallel with the gate line 12 constitute the dummy transistorD1. The n-channel transistor N1 shares its source, to which the groundpotential is supplied as an exemplary power supply potential, with thedummy transistor D1. Also, the fin 11 and a dummy gate line 15 providedon the fin 11 in parallel with the gate line 13 constitute the dummytransistor D2. The n-channel transistor N2 shares its source, to whichthe ground potential is supplied, with the dummy transistor D2. Thesources, drains, and gates of the dummy transistors D1 and D2 are allconnected to the ground line 8 a functioning as an exemplary powersupply line.

The n-channel transistor N1 shares its source with the dummy transistorD1, and shares its drain with the n-channel transistor N2 functioning asa third transistor. The n-channel transistor N2 shares its source withthe dummy transistor D2, and shares its drain with the n-channeltransistor N1 functioning as a third transistor. That is to say, in thelayout design of FIG. 1, in the n-type region, each of the activetransistors N1 and N2 shares both nodes as its source and drain withassociated ones of the other transistors.

According to the layout design of FIG. 1, the dummy transistors D1 andD2 are arranged near the respective terminal portions of the fin 11, andthe n-channel transistors N1 and N2 functioning as active transistorsare arranged distant from those terminal portions of the fin 11. That isto say, the active transistors N1 and N2 are not positioned at any ofthe terminal portions of the fin 11 that are highly likely to have anarrower fin width. This allows for eliminating the influence caused bytapering of the terminal portions of the fin 11 on the activetransistors N1 and N2, thus reducing a variation in performance betweenthe active transistors N1 and N2. As a result, this allows for improvingelectrical contact between the active transistors N1 and N2 and thelocal interconnect and increasing the yield of the semiconductor chips.

FIG. 3 is a plan view illustrating a comparative example of the layoutdesign of FIG. 1. According to the layout design of FIG. 3, a fin 11Ashorter than the fin 11 is disposed, and the n-channel transistors N1and N2 are disposed near respective terminal portions of that fin 11A(as indicated by the one-dot-chain circles). No dummy transistors areformed in this comparative example.

It is not necessary to provide the dummy transistors D1 and D2 if thelogical function of the NOR circuit of FIG. 2 has only to beimplemented. Therefore, if the layout is designed just to implement thelogical function of the NOR circuit of FIG. 2 without taking theinfluence caused by tapering of the terminal portions of the fin intoaccount, the layout design may have no dummy transistors D1 and D2, asillustrated in FIG. 3.

However, in the layout design of FIG. 3, the n-channel transistors N1and N2 are disposed at the respective terminal portions of the fin 11A,and therefore, may be affected by tapering of the terminal portions,which could prevent the circuit from achieving the desired performance.Thus, use of the layout design of FIG. 3 increases the chances ofcausing a variation in performance between the semiconductor chips, orcausing a decrease in their yield. In particular, in cells constitutinga clock tree through which a clock signal propagates, such a variationin performance needs to be reduced. Therefore, it is effective to adoptthe layout design of FIG. 1 instead of the layout design of FIG. 3. Thisadvantage of reducing such a variation is achievable in not only thecells constituting a clock tree but also other kinds of cells as well.

In this embodiment, each n-channel transistor functioning as an activetransistor shares its source with its associated dummy transistor.However, the present disclosure is not limited thereto. For example,each active transistor may share its drain with its associated dummytransistor. Alternatively, each p-channel transistor functioning as anactive transistor may share one of its source or drain with itsassociated dummy transistor. In that case, the other of the activetransistor's source or drain shared with the dummy transistor may, orneed not, be shared with another dummy transistor.

Second Embodiment

FIG. 4 is a plan view illustrating an exemplary layout design of astandard cell included in a semiconductor integrated circuit deviceaccording to a second embodiment. The standard cell 2 illustrated inFIG. 4 is a cell performing the function of a two-input NOR circuitillustrated in FIG. 2. Each transistor in FIG. 2 includes two fins.

As illustrated in FIG. 4, the standard cell 2 has fins 11, 16, 21, and22 which extend in the lateral direction on the paper (i.e., a firstdirection). The fins 11 and 21 are used to form an n-channel transistorin an n-type region, while the fins 16 and 22 are used to form ap-channel transistor in a p-type region. In other words, gate lines 12and 13 extending in the vertical direction on the paper (i.e., a seconddirection perpendicular to the first direction) and provided on the fin11 respectively constitute, together with the fin 11, n-channeltransistors N1 and N2 functioning as active transistors. The gate lines12 and 13 extending over the fin 21 which serves as a second finrespectively constitute, together with the fin 21, n-channel transistorsN1 a and N2 a functioning as second active transistors.

Also, gate lines 17, 12, 13, and 18 extending in the vertical directionon the paper and provided on the fin 16 respectively constitute,together with the fin 16, p-channel transistors P1, P2, P3, and P4functioning as active transistors. Also, the gate lines 17, 12, 13, and18 extending over the fin 22 respectively constitute, together with thefin 22, p-channel transistors P1 a, P2 a, P3 a, and P4 a.

A ground line 8 a supplying a ground potential is disposed at the lowerend of the standard cell 2 so as to extend in the lateral direction onthe paper. A power supply line 8 b supplying a power supply potential isdisposed at the upper end of the standard cell 2 so as to extend in thelateral direction on the paper. Dummy gate lines 9 a and 9 b arerespectively disposed at the left and right ends of the standard cell 2so as to extend in the vertical direction on the paper.

In addition, dummy transistors D1 and D2 are further formed on the fin11, and dummy transistors D1 a and D2 a are further formed on the fin21. That is to say, the fin 11 and a dummy gate line 14 provided on thefin 11 in parallel with the gate line 12 constitute the dummy transistorD1. Also, the fin 11 and a dummy gate line 15 provided on the fin 11 inparallel with the gate line 13 constitute the dummy transistor D2. Then-channel transistor N1 shares its source, to which the ground potentialis supplied, with the dummy transistor D1. The n-channel transistor N2shares its source, to which the ground potential is supplied, with thedummy transistor D2. Furthermore, the fin 21 and a dummy gate line 14provided on the fin 21 constitute the dummy transistor D1 a. Also, thefin 21 and a dummy gate line 15 extending over the fin 21 constitute thedummy transistor D2 a. The n-channel transistor N1 a shares its source,to which the ground potential is supplied, with the dummy transistor D1a. The n-channel transistor N2 a shares its source, to which the groundpotential is supplied, with the dummy transistor D2 a. The source,drain, and gate of each of the dummy transistors D1, D2, D1 a, and D2 aare all connected to the ground line 8 a.

The n-channel transistor N1 shares its source with the dummy transistorD1, and shares its drain with the n-channel transistor N2. The n-channeltransistor N2 shares its source with the dummy transistor D2, and sharesits drain with the n-channel transistor N1. The n-channel transistor N1a shares its source with the dummy transistor D1 a, and shares its drainwith the n-channel transistor N2 a. The n-channel transistor N2 a sharesits source with the dummy transistor D2 a, and shares its drain with then-channel transistor N1 a. That is to say, in the layout design of FIG.4, in the n-type region, each of all the active transistors N1, N2, N1a, and N2 a has both nodes as its source and drain with associated onesof the other transistors.

According to the layout design of FIG. 4, the dummy transistors D1 andD2 are arranged near the respective terminal portions of the fin 11, andthe n-channel transistors N1 and N2 are arranged distant from thoseterminal portions of the fin 11. That is to say, the active transistorsN1 and N2 are not positioned at the terminal portions of the fin 11 thatare highly likely to have a narrower fin width. Likewise, the dummytransistors D1 a and D2 a are arranged near the respective terminalportions of the fin 21, and the n-channel transistors N1 a and N2 a arearranged distant from those terminal portions of the fin 21. That is tosay, the active transistors N2 a and N2 a are not positioned at theterminal portions of the fin 21 that are highly likely to have anarrower fin width. This allows for eliminating the influence caused bytapering of the terminal portions of the fin 11 on the activetransistors N1 and N2 and the influence caused by tapering of theterminal portions of the fin 21 on the active transistors N1 a and N2 a,thus reducing a variation in performance between the active transistorsN1, N2, N1 a, and N2 a. As a result, this allows for improvingelectrical contact between the active transistors N1, N2, N1 a and N2 aand the local interconnects and increasing the yield of thesemiconductor chips.

FIG. 5 is a plan view illustrating a comparative example of the layoutdesign of FIG. 4. In the layout design of FIG. 5, only one fin 11B isprovided to form n-channel transistors, and the n-channel transistors N1a and N2 a are disposed near the respective terminal portions of the fin11B (as indicated by the one-dot-chain circles). No dummy transistorsare formed.

In a situation where the NOR circuit illustrated in FIG. 2 (except thedummy transistors D1 and D2) is formed using two fins for eachtransistor, if the layout is designed without taking the influencecaused by tapering of the terminal portions of the fin into account, thelayout design will be as illustrated in FIG. 5.

However, in the layout design of FIG. 5, the n-channel transistors N1 aand N2 a are disposed near the respective terminal portions of the fin11B, and therefore, may be affected by tapering of the terminalportions, which could prevent the circuit from achieving the desiredperformance. Thus, use of the layout design of FIG. 5 increases thechances of causing a variation in performance between the semiconductorchips, or causing a decrease in their yield. In particular, in cellsconstituting a clock tree through which a clock signal propagates, sucha variation in performance needs to be reduced. Therefore, it iseffective to adopt the layout design of FIG. 4 instead of the layoutdesign of FIG. 5. This advantage of reducing such a variation isachievable in not only the cells constituting a clock tree but alsoother kinds of cells as well.

FIG. 6 is a plan view illustrating another exemplary layout design for astandard cell according to this embodiment. Although the standard cell2A shown in FIG. 6 has the same circuit configuration as the one shownin FIG. 4, the n-channel transistors N1, N2, N1 a, and N2 a share theirdrains with the dummy transistors D1, D2, D1 a, and D2 a, respectively.Each of the dummy transistors D1, D2, D1 a, and D2 a has their sourceand drain connected to the ground line 8 a.

In the layout design of FIG. 6, the active transistors N1, N2, N1 a, andN2 a are not positioned, either, at the terminal portions of the fins 11and 21 that are highly likely to have a narrower fin width as in thelayout design of FIG. 4. This allows for eliminating the influencecaused by tapering of the terminal portions of the fin 11 on the activetransistors N1 and N2 and the influence caused by tapering of theterminal portions of the fin 21 on the active transistors N1 a and N2 a,thus reducing a variation in performance between the active transistorsN1, N2, N1 a and N2 a.

FIG. 7 is a plan view illustrating yet another exemplary layout designfor a standard cell according to this embodiment. Although the standardcell 2B shown in FIG. 7 has the same circuit configuration as the oneshown in FIG. 4, each of the n-channel transistors N1, N2, N1 a, and N2a shares both nodes as its drain and source with associated ones of thedummy transistors. Each of the p-channel transistors P1, P4, P1 a, andP4 a has their drain connected to their associated dummy transistor'sdrain.

That is to say, in a region DN1, a fin 31 and a dummy gate line 33constitute a dummy transistor sharing its source with the n-channeltransistor N1, and a fin 32 and the dummy gate line 33 constitute adummy transistor with which the n-channel transistor N1 a shares itssource. In a region DN2, the fin 31 and a dummy gate line 34 constitutea dummy transistor with which the n-channel transistor N1 shares itsdrain, and the fin 32 and the dummy gate line 34 constitute a dummytransistor with which the n-channel transistor N1 a shares its drain.The fin 31 and a dummy gate line 35 constitute a dummy transistor withwhich the n-channel transistor N2 shares its drain, and the fin 32 andthe dummy gate line 35 constitute a dummy transistor with which then-channel transistor N2 a shares its drain. In a region DN3, the fin 31and a dummy gate line 36 constitute a dummy transistor with which then-channel transistor N2 shares its source, and the fin 32 and the dummygate line 36 constitute a dummy transistor with which the n-channeltransistor N2 a shares its source.

In a region DP1, a fin 37 and a dummy gate line 39 constitute a dummytransistor with which the p-channel transistor P1 a shares its drain,and a fin 38 and the dummy gate line 39 constitute a dummy transistorwith which the p-channel transistor P1 shares its drain. In a regionDP2, the fin 37 and a dummy gate line 40 constitute a dummy transistorwith which the p-channel transistor P4 a shares its drain, and the fin38 and the dummy gate line 40 constitute a dummy transistor with whichthe p-channel transistor P4 shares its drain.

The layout design of FIG. 7 also achieves the same or similar advantageas/to that in FIG. 4. In the layout design of FIG. 7, each of the activetransistors N1, N2, N1 a, N2 a, P1, P2, P3, P4, P1 a, P2 a, P3 a, and P4a shares both nodes as its source and drain with associated ones of theother transistors. All of them are thus arranged distant from theterminal portions of the fins 31, 32, 37, and 38. This allows forreducing a variation in performance between all the active transistors.

Other Exemplary Layout Designs

FIG. 8 is a plan view illustrating another exemplary layout design for astandard cell according to another embodiment. FIG. 9 is a circuitdiagram of the standard cell of FIG. 8. In FIG. 8, each transistor ofFIG. 9 uses two fins. In the layout design of FIG. 8, dummy transistorsare formed at terminal portions of fins 41 and 42. In a region DN4illustrated on the left-hand side of the paper, the fins 41, 42 anddummy gate lines 43, 44 constitute dummy transistors. In a region DNSillustrated on the right-hand side of the paper, the fins 41, 42 anddummy gate lines 45, 46 constitute dummy transistors.

FIG. 10 is a plan view illustrating yet another exemplary layout designfor a standard cell according to another embodiment. FIG. 11 is acircuit diagram of the standard cell of FIG. 10. In FIG. 10, eachtransistor of FIG. 11 uses two fins. In the layout design of FIG. 10,dummy transistors are formed at terminal portions of fins 51 and 52. Ina region DN6 illustrated on the left-hand side of the paper, the fins51, 52 and a dummy gate line 53 constitute a dummy transistor. In aregion DN7 illustrated on the right-hand side of the paper, the fins 51,52 and dummy gate lines 54, 55, 56 constitute dummy transistors.

In the foregoing description of embodiments, a NOR circuit has beendescribed as an exemplary circuit according to the present disclosure,but this is only an exemplary embodiment of the present disclosure. Forexample, the present disclosure is also applicable in the same orsimilar manner to semiconductor integrated circuit devices performingother logical functions such as inverters, NAND gates, and flip-flops.

In the foregoing description of embodiments, if the dummy transistor is,e.g., an n-channel transistor, a ground potential is supplied to itsgate to fix the gate potential. However, the present disclosure is notlimited to this configuration. Alternatively, another configuration notcontributing to any logical function may be adopted. For example, in thecase of an n-channel transistor, a power supply potential may besupplied to its gate, and a ground potential may be supplied to itssource and drain.

The present disclosure allows for reducing, in a semiconductorintegrated circuit device including a standard cell having a fintransistor, the influence caused by tapering of the terminal portion ofthe fin. Thus, this is useful for reducing a variation in performancebetween the semiconductor integrated circuit devices.

What is claimed is:
 1. A semiconductor integrated circuit devicecomprising: a standard cell having a first fin and a second fin each ofwhich extends in a first direction in a first conductivity-type region,wherein the standard cell comprises: an active transistor including agate line extending in a second direction perpendicular to the firstdirection, the first fin and the second fin, nodes of the first fin andthe second fin at both sides of the gate line in the first directionbeing source and drain of the active transistor; and a dummy transistorincluding a dummy gate line extending in the second direction, the firstfin and the second fin, nodes of the first fin and the second fin atboth sides of the dummy gate line in the first direction being sourceand drain of the dummy transistor, and the active transistor shares oneof its source or drain with the dummy transistor.
 2. The semiconductorintegrated circuit device of claim 1, wherein the standard cellcomprises: a third transistor including a second gate line extending inthe second direction and provided on the opposite side of the gate linefrom the dummy gate line, the first fin and the second fin, nodes of thefirst fin and the second fin at both sides of the second gate line inthe first direction being source and drain of the third transistor, andthe active transistor shares another of its drain or source with thethird transistor.
 3. The semiconductor integrated circuit device ofclaim 2, wherein the third transistor functions as a second activetransistor.
 4. The semiconductor integrated circuit device of claim 2,wherein the third transistor functions as a second dummy transistor. 5.The semiconductor integrated circuit device of claim 1, wherein the nodeof the active transistor shared with the dummy transistor is its sourceto which a power supply potential is supplied.
 6. The semiconductorintegrated circuit device of claim 5, wherein the source and drain, andthe dummy gate line of the dummy transistor are all connected to a powersupply line.
 7. The semiconductor integrated circuit device of claim 1,wherein the node of the active transistor shared with the dummytransistor is its drain, and the dummy gate line of the dummy transistoris connected to a power supply line.
 8. The semiconductor integratedcircuit device of claim 1, wherein the standard cell comprises: a secondactive transistor including a second gate line extending in the seconddirection, the first fin and the second fin, nodes of the first fin andthe second fin at both sides of the second gate line in the firstdirection being source and drain of the second active transistor, andeach of the active transistor and the second active transistor sharesboth of its source and drain with associated ones of other transistors.9. The semiconductor integrated circuit device of claim 8, wherein thesecond active transistor shares one of its source or drain with a seconddummy transistor.
 10. A semiconductor integrated circuit devicecomprising: a standard cell having a first fin and a second fin each ofwhich extends in a first direction in a first conductivity-type regionand a third fin and a fourth fin extending in the first direction in asecond conductivity-type region which is different from the firstconductivity-type region, wherein the standard cell comprises: a firstactive transistor including a first gate line extending in a seconddirection perpendicular to the first direction, the first fin and thesecond fin, nodes of the first fin and the second fin at both sides ofthe first gate line in the first direction being source and drain of thefirst active transistor; and a first dummy transistor including a firstdummy gate line extending in the second direction, the first fin and thesecond fin, nodes of the first fin and the second fin at both sides ofthe first dummy gate line in the first direction being source and drainof the first dummy transistor; and a second active transistor includinga second gate line extending in the second direction at the sameposition as the first gate line in the first direction, the third finand the fourth fin, nodes of the third fin and the fourth fin at bothsides of the second gate line in the first direction being source anddrain of the second active transistor, and the first active transistorshares one of its source or drain with the first dummy transistor. 11.The semiconductor integrated circuit device of claim 10, wherein thestandard cell comprises: a third transistor including a third gate lineextending in the second direction and provided on the opposite side ofthe first gate line from the first dummy gate line, the first fin andthe second fin, nodes of the first fin and the second fin at both sidesof the third gate line in the first direction being source and drain ofthe third transistor, and the first active transistor shares another ofits drain or source with the third transistor.
 12. The semiconductorintegrated circuit device of claim 11, wherein the third transistorfunctions as a third active transistor.
 13. The semiconductor integratedcircuit device of claim 10, wherein the node of the first activetransistor shared with the first dummy transistor is its source to whicha power supply potential is supplied.
 14. The semiconductor integratedcircuit device of claim 13, wherein the source and drain, and the firstdummy gate line of the first dummy transistor are all connected to apower supply line.
 15. The semiconductor integrated circuit device ofclaim 10, wherein the node of the first active transistor shared withthe first dummy transistor is its drain, and the first dummy gate lineof the first dummy transistor is connected to a power supply line. 16.The semiconductor integrated circuit device of claim 10, wherein thestandard cell comprises: a third active transistor including a thirdgate line extending in the second direction, the first fin and thesecond fin, nodes of the first fin and the second fin at both sides ofthe third gate line in the first direction being source and drain of thethird active transistor, and each of the first active transistor and thethird active transistor shares both of its source and drain withassociated ones of other transistors.
 17. The semiconductor integratedcircuit device of claim 16, wherein the third active transistor sharesone of its source or drain with a second dummy transistor.
 18. Thesemiconductor integrated circuit device of claim 10, wherein thestandard cell comprises: a fourth transistor including a fourth gateline extending in the second direction at the same position as the firstdummy gate line in the first direction, the third fin and the fourthfin, nodes of the third fin and the fourth fin at both sides of thefourth gate line in the first direction being source and drain of thefourth transistor, and the second active transistor shares one of itssource or drain with the fourth transistor.
 19. The semiconductorintegrated circuit device of claim 18, wherein the fourth transistorfunctions as a fourth active transistor.
 20. The semiconductorintegrated circuit device of claim 18, wherein the fourth transistorfunctions as a third dummy transistor.